MC9S08DV60AMLF vs MC9S08DN32AMLC तुलना
विस्तृत दोनों ओर की तुलना MC9S08DV60AMLF द्वारा NXP Semiconductors और MC9S08DN32AMLC द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MC9S08DV60AMLF ✓ सक्रिय
विशेषता तुलना
| पैरामीटर | MC9S08DV60AMLF | MC9S08DN32AMLC |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | 25 |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | 12-bit, up to 16 channels, 2.5 us conversion |
| Timers | Multiple TPM (per datasheet family) | — |
| पैकेज | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | -40C to +125C | -40 C to +125 C |
| RoHS स्थिति | ROHS3 Compliant | Compliant |
| Debug Interface | Single-wire BDM | Background Debug Mode (BDM) |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| सप्लाई वोल्टेज | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| Oscillator Type | — | External |