MPC8245LZU266D vs MPC8245LVV300D तुलना
विस्तृत दोनों ओर की तुलना MPC8245LZU266D द्वारा NXP Semiconductors और MPC8245LVV300D द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | MPC8245LZU266D | MPC8245LVV300D |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | MPC82xx |
| Part Status | Active | Active |
| Core Processor | PowerPC 603e | PowerPC 603e |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | SDRAM (64-bit) |
| Graphics Acceleration | No | No |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | None |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | [DATA_NEEDED: integrated Ethernet MAC count] |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| सप्लाई वोल्टेज | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| ऑपरेटिंग तापमान | 0 C to +105 C (commercial) | 0 C to 105 C |
| पैकेज | 352-TBGA (35 mm x 35 mm) | 352-TBGA (35 x 35 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| RoHS स्थिति | [DATA_NEEDED: confirm per lot] | — |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Number of Cores | — | 1 |
| डेटा बस चौड़ाई | — | 32-bit |
| Core Frequency | — | 300 MHz |
| Co-Processors / DSP | — | None |
| USB | — | [DATA_NEEDED: integrated USB] |
| PCI Bridge | — | PCI 2.2, 32-bit, up to 66 MHz |