MPC8245LZU266D vs MPC8245LVV300D 比較

詳細並排比較 MPC8245LZU266D 由 NXP Semiconductors 與 MPC8245LVV300D 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8245LZU266D MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D ✓ 啟用中
NXP Semiconductors
MPC8245LVV300D MPC8245LVV300D - PowerPC 603e MPU 300MHz PCI Host | NXP

MPC8245LVV300D - PowerPC 603e MPU 300MHz PCI Host | NXP

MPC8245LVV300D ✓ 啟用中

規格比較

參數 MPC8245LZU266D MPC8245LVV300D
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale)
Series MPC82xx MPC82xx
Part Status Active Active
Core Processor PowerPC 603e PowerPC 603e
Number of Cores / Bus Width 1 Core / 32-bit —
Speed (Clock Frequency) 266 MHz —
Performance 505.4 MIPS —
Co-Processor / DSP None —
RAM Controllers SDRAM SDRAM (64-bit)
Graphics Acceleration No No
Display & Interface Controllers [DATA_NEEDED: display controller details] None
Ethernet [DATA_NEEDED: integrated Ethernet?] [DATA_NEEDED: integrated Ethernet MAC count]
PCI Interface 32-bit, 33/66 MHz —
Memory Controller Max Frequency 133 MHz (SDRAM), up to 2 GB —
Serial I/O I2C, UART, I2O —
供應電壓 3.3 V (typ.) —
Process Technology 0.25 um CMOS —
工作溫度 0 C to +105 C (commercial) 0 C to 105 C
封裝 352-TBGA (35 mm x 35 mm) 352-TBGA (35 x 35 mm)
安裝類型 Surface Mount Surface Mount
Tray Quantity [DATA_NEEDED: tray qty per manufacturer packing] —
RoHS 狀態 [DATA_NEEDED: confirm per lot] —
Lead-Free Status Lead-free (BGA balls, SnAgCu) —
Number of Cores — 1
資料匯流排寬度 — 32-bit
Core Frequency — 300 MHz
Co-Processors / DSP — None
USB — [DATA_NEEDED: integrated USB]
PCI Bridge — PCI 2.2, 32-bit, up to 66 MHz

資料表與資源

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