MPC8245LZU266D vs MPC8245LVV300D Perbandingan
Perbandingan bersamaan detil MPC8245LZU266D dari NXP Semiconductors dan MPC8245LVV300D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC8245LZU266D | MPC8245LVV300D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx | MPC82xx |
| Part Status | Active | Active |
| Core Processor | PowerPC 603e | PowerPC 603e |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | SDRAM (64-bit) |
| Graphics Acceleration | No | No |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | None |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | [DATA_NEEDED: integrated Ethernet MAC count] |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| Tegangan Pemuat | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | — |
| Suhu Kerja | 0 C to +105 C (commercial) | 0 C to 105 C |
| Paket | 352-TBGA (35 mm x 35 mm) | 352-TBGA (35 x 35 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| Status RoHS | [DATA_NEEDED: confirm per lot] | — |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Number of Cores | — | 1 |
| Lebar Bus Data | — | 32-bit |
| Core Frequency | — | 300 MHz |
| Co-Processors / DSP | — | None |
| USB | — | [DATA_NEEDED: integrated USB] |
| PCI Bridge | — | PCI 2.2, 32-bit, up to 66 MHz |