10AX090R3F40E2LG vs 10AX090S3F45E2LG Perbandingan

Perbandingan bersamaan detil 10AX090R3F40E2LG dari Intel dan 10AX090S3F45E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10AX090R3F40E2LG 10AX090S3F45E2LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria 10 GX —
Logic Elements 900,000 900,000
Embedded Memory 59,234,304 bits —
User I/O Count 342 —
Process Technology 20 nm —
Core Supply Voltage 0.9 V —
Paket 1517-Ball FCBGA 1932-ball FCBGA (F45, 45mm flip-chip BGA)
Package Type Flip-Chip Ball Grid Array —
Tipe Mounting Surface Mount Surface Mount (BGA)
Number of Terminals 1517 —
Transceivers Multi-gigabit serial transceivers (on-die) 624 (per package aggregate channels)
DSP Blocks Hardened fixed/floating-point DSP blocks (on-die) 1,518
Memory Interfaces Hardened DDR3/DDR4 memory controller IP DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3
Hard IP PCI Express Gen3, 10/40/100 GbE Ethernet —
Configuration Partial reconfiguration supported —
Status RoHS Compliant Compliant
Series — Arria 10 GX
Adaptive Logic Modules (ALMs) — 339,620
Embedded Memory (bits) — 59,234,304
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
Process Node — TSMC 20nm
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
Rentang Suhu Kerja — 0C to 100C (E2 commercial)
Speed Grade — S3 (-2 speed grade equivalent)

Spek dan Sumber

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