10AX090R3F40E2LG vs 10AX090S3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R3F40E2LG sa pamamagitan ng Intel at 10AX090S3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R3F40E2LG | 10AX090S3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | — |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits | — |
| User I/O Count | 342 | — |
| Process Technology | 20 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Packhaging | 1517-Ball FCBGA | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Package Type | Flip-Chip Ball Grid Array | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Number of Terminals | 1517 | — |
| Transceivers | Multi-gigabit serial transceivers (on-die) | 624 (per package aggregate channels) |
| DSP Blocks | Hardened fixed/floating-point DSP blocks (on-die) | 1,518 |
| Memory Interfaces | Hardened DDR3/DDR4 memory controller IP | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |
| Hard IP | PCI Express Gen3, 10/40/100 GbE Ethernet | — |
| Configuration | Partial reconfiguration supported | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Arria 10 GX |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Hanay ng Temperature na Operasyon | — | 0C to 100C (E2 commercial) |
| Speed Grade | — | S3 (-2 speed grade equivalent) |