10AX115R2F40I2SG vs 10AX115R2F40E1SG Perbandingan
Perbandingan bersamaan detil 10AX115R2F40I2SG dari Intel dan 10AX115R2F40E1SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX115R2F40I2SG | 10AX115R2F40E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Family | Arria 10 | Arria 10 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Logic Array Blocks (LABs) | 35,650 | — |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) | — |
| Maximum User I/O | 342 | — |
| DSP Blocks | 1,518 variable-precision | 1,518 (variable-precision 20x19) |
| Transceivers | 24 channels, up to 17.4 Gbps | GX transceivers up to 14.2 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) | — |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | Extended (-E1) |
| Process Node | TSMC 20 nm | — |
| Paket | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch | 1517-ball FCBGA (F40) 40x40 mm |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 68,857,856 |
| Number of I/O | — | 342 |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, LPDDR3, QDR IV) |
| Hard PCIe Block | — | PCIe Gen3 x8 |
| Process Technology | — | 20 nm TSMC tri-gate (FinFET) |
| Speed Grade | — | -2 |
| Lead Free | — | Yes |
| Configuration | — | SRAM-based, supports partial reconfiguration |