10AX115R2F40I2SG vs 10AX115R2F40E1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40I2SG disebabkan oleh Intel dan 10AX115R2F40E1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40I2SG | 10AX115R2F40E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Family | Arria 10 | Arria 10 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Logic Array Blocks (LABs) | 35,650 | — |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) | — |
| Maximum User I/O | 342 | — |
| DSP Blocks | 1,518 variable-precision | 1,518 (variable-precision 20x19) |
| Transceivers | 24 channels, up to 17.4 Gbps | GX transceivers up to 14.2 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) | — |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | Extended (-E1) |
| Process Node | TSMC 20 nm | — |
| Kemasan | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch | 1517-ball FCBGA (F40) 40x40 mm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 68,857,856 |
| Number of I/O | — | 342 |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, LPDDR3, QDR IV) |
| Hard PCIe Block | — | PCIe Gen3 x8 |
| Process Technology | — | 20 nm TSMC tri-gate (FinFET) |
| Speed Grade | — | -2 |
| Lead Free | — | Yes |
| Configuration | — | SRAM-based, supports partial reconfiguration |