10AX115R2F40I2SG vs 10AX115R2F40E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R2F40I2SG sa pamamagitan ng Intel at 10AX115R2F40E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115R2F40E1SG - Arria 10 GX FPGA, 1150K LE, 1517-FCBGA | Intel
10AX115R2F40E1SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115R2F40I2SG | 10AX115R2F40E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | Arria 10 GX |
| Family | Arria 10 | Arria 10 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Logic Array Blocks (LABs) | 35,650 | — |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) | — |
| Maximum User I/O | 342 | — |
| DSP Blocks | 1,518 variable-precision | 1,518 (variable-precision 20x19) |
| Transceivers | 24 channels, up to 17.4 Gbps | GX transceivers up to 14.2 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) | — |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | Extended (-E1) |
| Process Node | TSMC 20 nm | — |
| Packhaging | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch | 1517-ball FCBGA (F40) 40x40 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 68,857,856 |
| Number of I/O | — | 342 |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, LPDDR3, QDR IV) |
| Hard PCIe Block | — | PCIe Gen3 x8 |
| Process Technology | — | 20 nm TSMC tri-gate (FinFET) |
| Speed Grade | — | -2 |
| Lead Free | — | Yes |
| Configuration | — | SRAM-based, supports partial reconfiguration |