10M02DCU324A7G vs 10M04DCU324A7G Perbandingan
Perbandingan bersamaan detil 10M02DCU324A7G dari Intel dan 10M04DCU324A7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M02DCU324A7G | 10M04DCU324A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | 4,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | Integrated (non-volatile configuration) |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | Yes (12-bit SAR, multiple channels) |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Suhu Hubung Kerja | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| Status RoHS | Compliant | — |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Process Node | — | 55 nm |
| Embedded Memory (bits) | — | 193,536 |
| Maximum User I/O | — | 246 |
| Paket | — | 324-pin UFBGA (U324) |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | 7 |
| Suhu Kerja | — | [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] |
| Configuration Memory | — | On-chip flash (instant-on, no external PROM) |
| AEC-Q100 Qualification | — | Yes (A-grade suffix) |
| Lead-Free / RoHS | — | Yes (G suffix) |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M04] |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count for 10M04] |