10M08DCF256I7G vs 10M08DCF484C8G Perbandingan
Perbandingan bersamaan detil 10M08DCF256I7G dari Intel dan 10M08DCF484C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M08DCF256I7G | 10M08DCF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | 250 |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Paket | 256-FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40C to +100C (Industrial) | Commercial (0C to +85C junction, per speed grade) |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | Dual on-chip flash (instant-on, dual-boot) |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm TSMC embedded NOR flash |
| Logic Elements | — | 8,000 |
| Embedded Memory (M9K) | — | 378 Kbits (49 M9K blocks) |
| Embedded Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Speed Grade | — | C8 (commercial, standard speed) |
| Core Voltage | — | 1.2 V (on-chip regulator) |
| PLLs | — | 2 |
| Global Clock Networks | — | Up to 16 |
| Integrated ADC | — | 12-bit SAR, up to 1 Msps |
| LVDS Support | — | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |