10M08DCF256I7G vs 10M08DCF484C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCF256I7G disebabkan oleh Intel dan 10M08DCF484C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCF256I7G | 10M08DCF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | 250 |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Kemasan | 256-FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | -40C to +100C (Industrial) | Commercial (0C to +85C junction, per speed grade) |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | Dual on-chip flash (instant-on, dual-boot) |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm TSMC embedded NOR flash |
| Logic Elements | — | 8,000 |
| Embedded Memory (M9K) | — | 378 Kbits (49 M9K blocks) |
| Embedded Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Speed Grade | — | C8 (commercial, standard speed) |
| Core Voltage | — | 1.2 V (on-chip regulator) |
| PLLs | — | 2 |
| Global Clock Networks | — | Up to 16 |
| Integrated ADC | — | 12-bit SAR, up to 1 Msps |
| LVDS Support | — | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |