10M08DCF484C8G vs 10M08DAF484I7P Perbandingan
Perbandingan bersamaan detil 10M08DCF484C8G dari Intel dan 10M08DAF484I7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M08DCF484C8G | 10M08DAF484I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | — |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) | — |
| Embedded Multiplier Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 250 | 250 |
| Paket | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | C8 (commercial, standard speed) | -7 |
| Process Technology | 55 nm TSMC embedded NOR flash | — |
| Core Voltage | 1.2 V (on-chip regulator) | 1.0 V |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) | — |
| PLLs | 2 | 4 |
| Global Clock Networks | Up to 16 | — |
| Integrated ADC | 12-bit SAR, up to 1 Msps | — |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) | — |
| Suhu Kerja | Commercial (0C to +85C junction, per speed grade) | -40 C to +100 C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory | — | 378 Kbits (46,080 M9K bits) |
| Pitch | — | 1.0 mm |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| DSP Blocks | — | Yes (24 x 18-bit multipliers) |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| User Flash | — | 8 Kbits (non-volatile) |