10M08DCF484C8G vs 10M08DAF484I7P Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DCF484C8G sa pamamagitan ng Intel at 10M08DAF484I7P sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DCF484C8G | 10M08DAF484I7P |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | — |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) | — |
| Embedded Multiplier Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 250 | 250 |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | C8 (commercial, standard speed) | -7 |
| Process Technology | 55 nm TSMC embedded NOR flash | — |
| Core Voltage | 1.2 V (on-chip regulator) | 1.0 V |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) | — |
| PLLs | 2 | 4 |
| Global Clock Networks | Up to 16 | — |
| Integrated ADC | 12-bit SAR, up to 1 Msps | — |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) | — |
| Temperature na Operasyon | Commercial (0C to +85C junction, per speed grade) | -40 C to +100 C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: moisture sensitivity level] |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory | — | 378 Kbits (46,080 M9K bits) |
| Pitch | — | 1.0 mm |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| DSP Blocks | — | Yes (24 x 18-bit multipliers) |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| User Flash | — | 8 Kbits (non-volatile) |