10M16DAF256C7G vs 10M08DAF256C7G Perbandingan
Perbandingan bersamaan detil 10M16DAF256C7G dari Intel dan 10M08DAF256C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M16DAF256C7G | 10M08DAF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 16000 | 8,000 |
| Maximum User I/O | 178 | 178 |
| Embedded Memory Bits | 562176 (549 Kbit) | — |
| Embedded RAM Blocks | M9K, 69 blocks (per family datasheet) | — |
| Configuration Memory | Dual-configuration flash (non-volatile) | — |
| Paket | 256-LBGA (F256), 17x17 mm | 256-pin LBGA (F256) |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in kB] | — |
| 18x18 Hardware Multipliers | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 2 |
| Integrated ADC | Yes, 12-bit SAR (per MAX 10 family) | — |
| Supply Voltage - Core | 1.2 V (dual-supply variants) | — |
| Supply Voltage - I/O | 3.3 V (or LVCMOS 1.2-3.3 V per bank) | — |
| Suhu Kerja | 0C to +85C (C7G suffix = commercial) | 0 °C to +85 °C (Commercial, "C" grade) |
| Speed Grade | 7 | — |
| Status RoHS | Compliant | Compliant (Pb-free "G" suffix) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | 3 (per JEDEC J-STD-020, BGA package) | — |
| Family | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| User Flash Memory | — | 387,072 bits (approx. 48 KB) |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Process Technology | — | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| Internal Oscillator | — | Yes (on-chip) |