10M25DAF256I7G vs 10M25DAF256C8G Perbandingan
Perbandingan bersamaan detil 10M25DAF256I7G dari Intel dan 10M25DAF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF256I7G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 691,200 bits (1,638 Kbit) | 1,728 Kbits |
| User I/Os | 178 | — |
| Paket | 256-FBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V (with 2.5 V analog supply) | [DATA_NEEDED: core voltage] |
| Suhu Kerja | -40 °C to +100 °C (Industrial) | — |
| Embedded Multipliers (18x18) | 45 | — |
| PLLs | 4 | 4 |
| User Flash | 2,048 Kbit (2 KB per CFM block) | — |
| Integrated ADC | Yes, 12-bit SAR | — |
| Configuration Method | On-chip non-volatile flash (CFM) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Speed Grade | 7 | C8 |
| Supply Configuration | Dual-supply (DAF sub-family) | — |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |
| Level MSL | — | [DATA_NEEDED: MSL level] |