10M25DAF256I7G vs 10M25DAF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF256I7G disebabkan oleh Intel dan 10M25DAF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF256I7G | 10M25DAF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 691,200 bits (1,638 Kbit) | 1,728 Kbits |
| User I/Os | 178 | — |
| Kemasan | 256-FBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V (with 2.5 V analog supply) | [DATA_NEEDED: core voltage] |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | — |
| Embedded Multipliers (18x18) | 45 | — |
| PLLs | 4 | 4 |
| User Flash | 2,048 Kbit (2 KB per CFM block) | — |
| Integrated ADC | Yes, 12-bit SAR | — |
| Configuration Method | On-chip non-volatile flash (CFM) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Speed Grade | 7 | C8 |
| Supply Configuration | Dual-supply (DAF sub-family) | — |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |
| Aras MSL | — | [DATA_NEEDED: MSL level] |