10M25DAF484A7G vs 10M25DAF484A7P Perbandingan
Perbandingan bersamaan detil 10M25DAF484A7G dari Intel dan 10M25DAF484A7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF484A7G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Paket | 484-ball BGA | 484-ball Plastic BGA (S-PBGA-B484) |
| Suhu Kerja | -40C to +125C (automotive) | — |
| Configuration Memory | On-chip flash (non-volatile) | — |
| PLLs | 8 | 2 (general-purpose) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | 1 x 12-bit, 1 MSPS |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Process Technology | — | 55 nm non-volatile |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Speed Grade | — | A7 |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tegangan Pemuat | — | 3.3 V or 1.8 V single supply |