10M25DAF484A7G vs 10M25DAF484A7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484A7G disebabkan oleh Intel dan 10M25DAF484A7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484A7G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Kemasan | 484-ball BGA | 484-ball Plastic BGA (S-PBGA-B484) |
| Suhu Operasi | -40C to +125C (automotive) | — |
| Configuration Memory | On-chip flash (non-volatile) | — |
| PLLs | 8 | 2 (general-purpose) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | 1 x 12-bit, 1 MSPS |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Process Technology | — | 55 nm non-volatile |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Speed Grade | — | A7 |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tegangan Pemberi Arus | — | 3.3 V or 1.8 V single supply |