10M50DAF256I7G vs 10M50DCF256A7G Perbandingan
Perbandingan bersamaan detil 10M50DAF256I7G dari Intel dan 10M50DCF256A7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF256I7G | 10M50DCF256A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Paket | 256-LBGA (17 mm x 17 mm) | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Kerja | -40C to +100C (Industrial) | -40 C to +85 C (industrial) |
| Process Technology | TSMC 55 nm embedded flash | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| Status RoHS | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | — |
| User Flash Memory | — | 1,677,312 bits |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Speed Grade | — | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | — | M9K blocks, 9 Kbits each |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| Level MSL | — | 3 (168 hours) |