10M50DCF256A7G vs 10M50DCF256C7G Perbandingan
Perbandingan bersamaan detil 10M50DCF256A7G dari Intel dan 10M50DCF256C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DCF256A7G | 10M50DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| User I/O Count | 178 | — |
| Paket | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Suhu Kerja | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | -7 |
| Embedded Memory | M9K blocks, 9 Kbits each | — |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Level MSL | 3 (168 hours) | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| PLLs | — | 2 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 55 nm TSMC |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to 85C) |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |