10M50DCF256A7G vs 10M50DCF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DCF256A7G sa pamamagitan ng Intel at 10M50DCF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DCF256A7G | 10M50DCF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| User I/O Count | 178 | — |
| Packhaging | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Temperature na Operasyon | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | -7 |
| Embedded Memory | M9K blocks, 9 Kbits each | — |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Level ng MSL | 3 (168 hours) | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| PLLs | — | 2 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 55 nm TSMC |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to 85C) |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |