10M50DCF256A7G vs 10M50DCF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256A7G disebabkan oleh Intel dan 10M50DCF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256A7G | 10M50DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| User I/O Count | 178 | — |
| Kemasan | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Suhu Operasi | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | -7 |
| Embedded Memory | M9K blocks, 9 Kbits each | — |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Aras MSL | 3 (168 hours) | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| PLLs | — | 2 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 55 nm TSMC |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to 85C) |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |