10M50DCF256A7G vs 10M50DCF256C8G Perbandingan
Perbandingan bersamaan detil 10M50DCF256A7G dari Intel dan 10M50DCF256C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DCF256A7G | 10M50DCF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| User I/O Count | 178 | — |
| Paket | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-pin FBGA (FBGA256), 17x17 mm |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Suhu Kerja | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | 8 |
| Embedded Memory | M9K blocks, 9 Kbits each | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 (168 hours) | — |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Temperature Grade | — | Commercial (C suffix) |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| Process Technology | — | TSMC 55 nm embedded flash CMOS |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |
| Configuration Method | — | On-die non-volatile flash (instant-on); dual-boot supported |