10M50DCF256A7G vs 10M50DCF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256A7G disebabkan oleh Intel dan 10M50DCF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256A7G | 10M50DCF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| User I/O Count | 178 | — |
| Kemasan | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-pin FBGA (FBGA256), 17x17 mm |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Suhu Operasi | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | 8 |
| Embedded Memory | M9K blocks, 9 Kbits each | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Temperature Grade | — | Commercial (C suffix) |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| Process Technology | — | TSMC 55 nm embedded flash CMOS |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |
| Configuration Method | — | On-die non-volatile flash (instant-on); dual-boot supported |