10M50DCF256C8G vs 10M50DCF256C7G Perbandingan
Perbandingan bersamaan detil 10M50DCF256C8G dari Intel dan 10M50DCF256C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DCF256C8G | 10M50DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Paket | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (FineLine BGA) |
| Temperature Grade | Commercial (C suffix) | Commercial (0C to 85C) |
| Speed Grade | 8 | -7 |
| PLLs | 4 | 2 |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm TSMC |
| Core Voltage | 1.0 V (internal) | — |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |