10M50DCF256C8G vs 10M50DCF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256C8G disebabkan oleh Intel dan 10M50DCF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256C8G | 10M50DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Kemasan | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (FineLine BGA) |
| Temperature Grade | Commercial (C suffix) | Commercial (0C to 85C) |
| Speed Grade | 8 | -7 |
| PLLs | 4 | 2 |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm TSMC |
| Core Voltage | 1.0 V (internal) | — |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |