10M50DCF256C8G vs 10M50DCF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DCF256C8G sa pamamagitan ng Intel at 10M50DCF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DCF256C8G | 10M50DCF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits (1677 Kb) |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Packhaging | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (FineLine BGA) |
| Temperature Grade | Commercial (C suffix) | Commercial (0C to 85C) |
| Speed Grade | 8 | -7 |
| PLLs | 4 | 2 |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm TSMC |
| Core Voltage | 1.0 V (internal) | — |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Maximum User I/O | — | 178 |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |