5CGXBC9C6F23C7N vs 5CGXBC9C7F23C8N Perbandingan
Perbandingan bersamaan detil 5CGXBC9C6F23C7N dari Intel dan 5CGXBC9C7F23C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 5CGXBC9C6F23C7N | 5CGXBC9C7F23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm TSMC low-power |
| Maximum Operating Frequency | 800 MHz | — |
| Paket | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Suhu Kerja | 0 °C to +85 °C (commercial, suffix 7) | 0 C to +85 C (commercial, 'C' speed grade) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (Pb-free) |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| Tipe Memori | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory Bits | — | 14,251,008 (9.4 Mbit) |
| User I/O Pins | — | 224 |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | 8 (C8) |
| Hard Memory Controllers | — | 2 (DDR3, DDR2, LPDDR2) |
| PLLs | — | 4 |
| Embedded Multipliers (18x19) | — | 156 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PCIe Hard IP | — | Gen2 x4 (1 hard IP block) |
| Level MSL | — | 3 (168 hours) |