5CGXBC9C6F23C7N vs 5CGXBC9C7F23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9C6F23C7N sa pamamagitan ng Intel at 5CGXBC9C7F23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC9C6F23C7N | 5CGXBC9C7F23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm TSMC low-power |
| Maximum Operating Frequency | 800 MHz | — |
| Packhaging | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Temperature na Operasyon | 0 °C to +85 °C (commercial, suffix 7) | 0 C to +85 C (commercial, 'C' speed grade) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| Uri ng Memory | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory Bits | — | 14,251,008 (9.4 Mbit) |
| User I/O Pins | — | 224 |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | 8 (C8) |
| Hard Memory Controllers | — | 2 (DDR3, DDR2, LPDDR2) |
| PLLs | — | 4 |
| Embedded Multipliers (18x19) | — | 156 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PCIe Hard IP | — | Gen2 x4 (1 hard IP block) |
| Level ng MSL | — | 3 (168 hours) |