A3PE3000L-FG484M vs A3PE3000L-FGG484 Perbandingan
Perbandingan bersamaan detil A3PE3000L-FG484M dari Microchip Technology dan A3PE3000L-FGG484 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ AktifMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3PE3000L-FG484M | A3PE3000L-FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3,000,000 |
| Logic Elements (VersaTiles) | 75264 | — |
| True Dual-Port SRAM | 504 kbits | — |
| User I/O | 341 (up to 616 in larger packages) | 341 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm flash |
| Logic Family | CMOS | — |
| Configuration Memory | Nonvolatile on-chip flash, live at power-up (Level 0) | — |
| Low-Power Feature | Flash*Freeze technology | — |
| Suhu Kerja | 0 to 70 C | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemuat | 1.5 V | — |
| Package Type | FBGA-484, 1 mm pitch, 23 x 23 mm | — |
| Pins / Balls | 484 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) | — |
| Logic Cells | — | 75,264 |
| Embedded RAM | — | 516,096 bits |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Low Power Feature | — | Flash*Freeze technology |
| Paket | — | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Status RoHS | — | Compliant (per Newark: RoHS Compliant: Yes) |
| Packaging | — | Tray |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |