A3PE3000L-FG484M vs A3PE3000L-FGG484 比較

詳細並排比較 A3PE3000L-FG484M 由 Microchip Technology 與 A3PE3000L-FGG484 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000L-FG484M A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M ✓ 啟用中
Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ 啟用中

規格比較

參數 A3PE3000L-FG484M A3PE3000L-FGG484
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3L (Flash-based FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 (3.00E6) 3,000,000
Logic Elements (VersaTiles) 75264 —
True Dual-Port SRAM 504 kbits —
User I/O 341 (up to 616 in larger packages) 341
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
Process Technology 130-nm, 7-layer metal (6 copper) flash-based CMOS 130 nm flash
Logic Family CMOS —
Configuration Memory Nonvolatile on-chip flash, live at power-up (Level 0) —
Low-Power Feature Flash*Freeze technology —
工作溫度 0 to 70 C [DATA_NEEDED: operating temperature range]
供應電壓 1.5 V —
Package Type FBGA-484, 1 mm pitch, 23 x 23 mm —
Pins / Balls 484 —
安裝類型 Surface Mount Surface Mount
Single-Chip Solution Yes (no external configuration device required) —
Logic Cells — 75,264
Embedded RAM — 516,096 bits
Configuration Technology — Nonvolatile flash, Instant On
Low Power Feature — Flash*Freeze technology
封裝 — 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch
Supply Voltage - I/O — [DATA_NEEDED: I/O bank voltage range]
RoHS 狀態 — Compliant (per Newark: RoHS Compliant: Yes)
Packaging — Tray
Security — Single-chip, flash-based, secure nonvolatile configuration

資料表與資源

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