A3PE600-2FGG484I vs A3PE600-FGG484 Perbandingan
Perbandingan bersamaan detil A3PE600-2FGG484I dari Microchip Technology dan A3PE600-FGG484 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-2FGG484I ✓ AktifMicrochip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | A3PE600-2FGG484I | A3PE600-FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements (CLBs) | 13824 | — |
| Number of Registers | [DATA_NEEDED: number of registers] | — |
| User I/Os (max, FG484) | 270 | — |
| Speed Grade | -2 | — |
| Core Supply Voltage | 1.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Technology | 130 nm Flash CMOS | — |
| Max System Frequency | 231 MHz | — |
| Embedded Memory | Embedded flash family; 110592 (bits, per distributor listing) | — |
| Configuration Memory | On-chip flash (single-chip, non-volatile) | On-chip flash (non-volatile, live at power-up) |
| Soft CPU Support | Optional soft ARM support | — |
| Paket | FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) | FBGA-484 (PBGA484) |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 484 | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Green / [DATA_NEEDED: RoHS compliance detail] |
| Packaging | Tray | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Maximum System Frequency | — | 350 MHz |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS flash |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Gaya Mounting | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |