ATSAMA5D26B-CNR vs ATSAMA5D26B-CN Perbandingan
Perbandingan bersamaan detil ATSAMA5D26B-CNR dari Microchip Technology dan ATSAMA5D26B-CN dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ AktifMicrochip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | ATSAMA5D26B-CNR | ATSAMA5D26B-CN |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | Arm Cortex-A5 (Armv7-A) with NEON and FPU | ARM Cortex-A5 (Armv7-A) |
| Maximum Core Frequency | 500 MHz | — |
| Core Count | 1 | — |
| Internal SRAM | 128 KB | — |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND | — |
| Paket | 289-LFBGA (14x14x1.4 mm) | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| Graphics Controller | 2D LCD controller, up to 2048x2048 | — |
| Ethernet | 2x EMAC with IEEE 1588 (10/100 Mbps) | — |
| USB | USB 2.0 High-Speed Host and Device | — |
| Serial Interfaces | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD | — |
| Audio | Embedded audio subsystem (SSC, I2S) | — |
| Security | Crypto accelerator, secure boot, tamper detection, TRNG | — |
| Suhu Kerja | -40C to +85C (Industrial) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Number of Cores | — | 1 |
| Frekuensi Bawah Maximum | — | 500 MHz |
| L1 Instruction Cache | — | 32 kbyte |
| L1 Data Cache | — | 32 kbyte |
| L2 Cache | — | 128 kbyte (configurable as SRAM) |
| Memory Management Unit | — | Yes (MMU) |
| NEON Media Processing Engine | — | Yes |
| Arm TrustZone | — | Yes |
| ETM/ETB Support | — | Yes |
| DDR Memory Interface | — | DDR2, DDR3L, LPDDR2, LPDDR3 |
| Flash Memory Interface | — | QSPI, e.MMC |
| Backup Mode Current | — | 5 uA |
| Security Features | — | Secure boot, AES, SHA, TRNG, tamper pins |
| Peripheral Interfaces | — | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC |
| Embedded Audio Subsystem | — | Yes |
| Rentang Suhu Kerja | — | -40C to +85C (industrial, -CN grade) |