ATSAMA5D26B-CNR vs ATSAMA5D26B-CN 比較
詳細並排比較 ATSAMA5D26B-CNR 由 Microchip Technology 與 ATSAMA5D26B-CN 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ 啟用中Microchip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ 啟用中規格比較
| 參數 | ATSAMA5D26B-CNR | ATSAMA5D26B-CN |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | Arm Cortex-A5 (Armv7-A) with NEON and FPU | ARM Cortex-A5 (Armv7-A) |
| Maximum Core Frequency | 500 MHz | — |
| Core Count | 1 | — |
| Internal SRAM | 128 KB | — |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND | — |
| 封裝 | 289-LFBGA (14x14x1.4 mm) | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| Graphics Controller | 2D LCD controller, up to 2048x2048 | — |
| Ethernet | 2x EMAC with IEEE 1588 (10/100 Mbps) | — |
| USB | USB 2.0 High-Speed Host and Device | — |
| Serial Interfaces | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD | — |
| Audio | Embedded audio subsystem (SSC, I2S) | — |
| Security | Crypto accelerator, secure boot, tamper detection, TRNG | — |
| 工作溫度 | -40C to +85C (Industrial) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| MSL 等級 | 3 | [DATA_NEEDED: MSL level] |
| RoHS 狀態 | Compliant | Compliant |
| Number of Cores | — | 1 |
| 最大時脈頻率 | — | 500 MHz |
| L1 Instruction Cache | — | 32 kbyte |
| L1 Data Cache | — | 32 kbyte |
| L2 Cache | — | 128 kbyte (configurable as SRAM) |
| Memory Management Unit | — | Yes (MMU) |
| NEON Media Processing Engine | — | Yes |
| Arm TrustZone | — | Yes |
| ETM/ETB Support | — | Yes |
| DDR Memory Interface | — | DDR2, DDR3L, LPDDR2, LPDDR3 |
| Flash Memory Interface | — | QSPI, e.MMC |
| Backup Mode Current | — | 5 uA |
| Security Features | — | Secure boot, AES, SHA, TRNG, tamper pins |
| Peripheral Interfaces | — | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC |
| Embedded Audio Subsystem | — | Yes |
| 工作溫度範圍 | — | -40C to +85C (industrial, -CN grade) |