EP1C12F324C8L vs EP1C12F324C6N Perbandingan
Perbandingan bersamaan detil EP1C12F324C8L dari Intel dan EP1C12F324C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C12F324C8L | EP1C12F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Cyclone | — |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Paket | FBGA-324 | 324-ball FineLine BGA |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | 6 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | CMOS, 130 nm | 130 nm SRAM |
| Suhu Kerja | 0C to +85C (commercial) | 0°C to 85°C (commercial; C6N suffix) |
| Power Variant | Low-power (L suffix) | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone® |
| Logic Elements (LE) | — | 12,060 |
| Logic Array Blocks (LAB) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Embedded Multipliers (9-bit) | — | 52 |
| Phase-Locked Loops (PLL) | — | 2 |
| Maximum User I/Os | — | 249 |
| Configuration Method | — | SRAM, serial/parallel via EPCS flash or JTAG |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, PCI, SSTL |