EP1C12F324C8L vs EP1C12F324C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C12F324C8L disebabkan oleh Intel dan EP1C12F324C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C12F324C8L | EP1C12F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Cyclone | — |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Kemasan | FBGA-324 | 324-ball FineLine BGA |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | 6 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | CMOS, 130 nm | 130 nm SRAM |
| Suhu Operasi | 0C to +85C (commercial) | 0°C to 85°C (commercial; C6N suffix) |
| Power Variant | Low-power (L suffix) | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone® |
| Logic Elements (LE) | — | 12,060 |
| Logic Array Blocks (LAB) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Embedded Multipliers (9-bit) | — | 52 |
| Phase-Locked Loops (PLL) | — | 2 |
| Maximum User I/Os | — | 249 |
| Configuration Method | — | SRAM, serial/parallel via EPCS flash or JTAG |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, PCI, SSTL |