EP1C4F324C6 vs EP1C4F324C7 Perbandingan
Perbandingan bersamaan detil EP1C4F324C6 dari Intel dan EP1C4F324C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C4F324C6 | EP1C4F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone | Cyclone |
| Logic Elements (LE) | 4,000 | — |
| Total RAM Bits | 78,336 | — |
| Maximum User I/O | 249 | 249 |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| PLLs | 2 | — |
| Process Technology | 130 nm | CMOS, 130 nm-class (Cyclone generation) |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Maximum Internal Frequency | 405.2 MHz | — |
| Package Type | 324-ball FineLine BGA (FBGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0C to +85C (commercial, C6 suffix) | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Configuration Method | Serial / JTAG | — |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Elements | — | 4 000 |
| Logic Array Blocks / CLBs | — | 400 CLBs |
| Embedded Memory (Bits) | — | 78 336 |
| Paket | — | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Core Supply Voltage | — | 1.5 V |
| Internal Frequency (max, family ref) | — | 405 MHz |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Level MSL | — | 3 (per JEDEC J-STD-020, typical for BGA-324) |