EP1C4F324C6N vs EP1C4F324C7N Perbandingan
Perbandingan bersamaan detil EP1C4F324C6N dari Intel dan EP1C4F324C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C4F324C6N | EP1C4F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Device Family | Cyclone | Cyclone |
| Logic Elements (LE) | 4,000 | — |
| Logic Array Blocks (LAB) | 400 | — |
| Total RAM Bits | 78,336 | 78336 bits (~9.6 KB) |
| Embedded Multipliers (17x17) | 20 | — |
| M4K RAM Blocks | 17 | — |
| Maximum User I/Os | 249 | 249 |
| PLLs | 2 | 2 |
| Global Clock Networks | 8 | — |
| Internal Operating Frequency | 405 MHz | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 0.13 um SRAM-based CMOS |
| Paket | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch | — |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, JTAG/Active Serial | — |
| Logic Elements | — | 4000 |
| Logic Array Blocks / CLBs | — | 249 LABs |
| Package Type | — | FBGA-324 (FineLine BGA) |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm ball pitch |
| Speed Grade | — | C7 (commercial, mid-speed) |
| Internal Frequency (max) | — | 405 MHz |
| Configuration Modes | — | Passive Serial, Active Serial, JTAG |
| Embedded Multipliers | — | Yes (DSP blocks) |
| Status RoHS | — | Compliant (lead-free FBGA) |
| Tipe Mounting | — | Surface Mount |