EP1C4F324C6N vs EP1C4F324C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C4F324C6N sa pamamagitan ng Intel at EP1C4F324C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C4F324C6N | EP1C4F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Device Family | Cyclone | Cyclone |
| Logic Elements (LE) | 4,000 | — |
| Logic Array Blocks (LAB) | 400 | — |
| Total RAM Bits | 78,336 | 78336 bits (~9.6 KB) |
| Embedded Multipliers (17x17) | 20 | — |
| M4K RAM Blocks | 17 | — |
| Maximum User I/Os | 249 | 249 |
| PLLs | 2 | 2 |
| Global Clock Networks | 8 | — |
| Internal Operating Frequency | 405 MHz | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 0.13 um SRAM-based CMOS |
| Packhaging | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, JTAG/Active Serial | — |
| Logic Elements | — | 4000 |
| Logic Array Blocks / CLBs | — | 249 LABs |
| Package Type | — | FBGA-324 (FineLine BGA) |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm ball pitch |
| Speed Grade | — | C7 (commercial, mid-speed) |
| Internal Frequency (max) | — | 405 MHz |
| Configuration Modes | — | Passive Serial, Active Serial, JTAG |
| Embedded Multipliers | — | Yes (DSP blocks) |
| Tindminan RoHS | — | Compliant (lead-free FBGA) |
| Uri ng Pagpapasok | — | Surface Mount |