EP1C4F324C7N vs EP1C4F324C7 Perbandingan
Perbandingan bersamaan detil EP1C4F324C7N dari Intel dan EP1C4F324C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1C4F324C7N | EP1C4F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Device Family | Cyclone | — |
| Logic Elements | 4000 | 4 000 |
| Logic Array Blocks / CLBs | 249 LABs | 400 CLBs |
| Total RAM Bits | 78336 bits (~9.6 KB) | — |
| Maximum User I/Os | 249 | — |
| PLLs | 2 | — |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS | CMOS, 130 nm-class (Cyclone generation) |
| Speed Grade | C7 (commercial, mid-speed) | — |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | Passive Serial (PS), Active Serial (AS), JTAG |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Suhu Kerja | 0C to +85C (commercial) | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Status RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | Cyclone |
| Embedded Memory (Bits) | — | 78 336 |
| Maximum User I/O | — | 249 |
| Paket | — | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Internal Frequency (max, family ref) | — | 405 MHz |
| Level MSL | — | 3 (per JEDEC J-STD-020, typical for BGA-324) |