EP1C4F324C7N vs EP1C4F324C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C4F324C7N disebabkan oleh Intel dan EP1C4F324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C4F324C7N | EP1C4F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Device Family | Cyclone | — |
| Logic Elements | 4000 | 4 000 |
| Logic Array Blocks / CLBs | 249 LABs | 400 CLBs |
| Total RAM Bits | 78336 bits (~9.6 KB) | — |
| Maximum User I/Os | 249 | — |
| PLLs | 2 | — |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS | CMOS, 130 nm-class (Cyclone generation) |
| Speed Grade | C7 (commercial, mid-speed) | — |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | Passive Serial (PS), Active Serial (AS), JTAG |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Suhu Operasi | 0C to +85C (commercial) | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Status RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | Cyclone |
| Embedded Memory (Bits) | — | 78 336 |
| Maximum User I/O | — | 249 |
| Kemasan | — | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Internal Frequency (max, family ref) | — | 405 MHz |
| Aras MSL | — | 3 (per JEDEC J-STD-020, typical for BGA-324) |