EP1S25F780C7 vs EP1S25F780C7N Perbandingan
Perbandingan bersamaan detil EP1S25F780C7 dari Intel dan EP1S25F780C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1S25F780C7 | EP1S25F780C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix | Stratix |
| Logic Elements | 25,660 | 25660 |
| LABs / CLBs | 2,566 LABs | — |
| Total Memory Bits | 1,944,576 bits | 1944576 |
| User I/Os | 597 | — |
| Paket | 780-ball FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1 mm | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V | — |
| Internal Performance | up to 420.17 MHz | — |
| Suhu Kerja | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 7 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Number of LABs | — | 2566 |
| Number of I/O | — | 597 |
| Package Type | — | 780-BBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Tegangan Pemuat | — | 1.5 V (core) |
| DSP Blocks | — | Embedded multiplier-accumulators |
| PLLs | — | 12 |
| Configuration Modes | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG, Active Serial (AS) |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |