EP1S25F780C7 vs EP1S25F780C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S25F780C7 disebabkan oleh Intel dan EP1S25F780C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1S25F780C7 | EP1S25F780C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix | Stratix |
| Logic Elements | 25,660 | 25660 |
| LABs / CLBs | 2,566 LABs | — |
| Total Memory Bits | 1,944,576 bits | 1944576 |
| User I/Os | 597 | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1 mm | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V | — |
| Internal Performance | up to 420.17 MHz | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 7 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Number of LABs | — | 2566 |
| Number of I/O | — | 597 |
| Package Type | — | 780-BBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Tegangan Pemberi Arus | — | 1.5 V (core) |
| DSP Blocks | — | Embedded multiplier-accumulators |
| PLLs | — | 12 |
| Configuration Modes | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG, Active Serial (AS) |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |