EP1SGX25DF672I5N vs EP1SGX25DF672C5N Perbandingan

Perbandingan bersamaan detil EP1SGX25DF672I5N dari Intel dan EP1SGX25DF672C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP1SGX25DF672I5N EP1SGX25DF672C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Family Stratix GX —
Logic Elements 25,660 25,660 LE
Logic Cells (CLBs) 2,566 —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V —
High-Speed Transceiver Channels 4 to 20 (CDR/SERDES) —
Max Transceiver Data Rate 3.1875 Gbps —
Paket 672-ball FC-FBGA —
Package Body Size 33 x 33 mm —
Ball Pitch 1.0 mm —
Suhu Kerja -40C to +85C (Industrial) 0 C to 85 C (Commercial)
Tipe Mounting Surface Mount Surface Mount (FBGA)
Lead-Free Yes —
Status RoHS Compliant —
Logic Family CMOS (SRAM-based FPGA) —
Total I/O Pins [DATA_NEEDED: total user I/O pin count] —
Embedded Memory [DATA_NEEDED: TriMatrix memory block count] —
Series — Stratix GX
User I/O Count — 455
Total RAM Bits — 1,944,576 bits
Supply Voltage (Core) — 1.5 V (1.425 V to 1.575 V)
Transceiver Data Rate — Up to 3.1875 Gbps
Number of Transceivers — 20
DSP Blocks — 10 (dedicated 18x18 multipliers)
Package Type — 672-ball Flip-Chip BGA (FBGA-672)
Package Dimensions — 27 mm x 27 mm, 1.0 mm pitch
Speed Grade — C5
Configuration Modes — PS, PPS, FPP, JTAG
Lead Free / RoHS — Lead free per Altera/Intel datasheet

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