EP1SGX25DF672I5N vs EP1SGX25DF672C5N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF672I5N disebabkan oleh Intel dan EP1SGX25DF672C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

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Pengandingan Spesifikasi

Parametr EP1SGX25DF672I5N EP1SGX25DF672C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family Stratix GX —
Logic Elements 25,660 25,660 LE
Logic Cells (CLBs) 2,566 —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V —
High-Speed Transceiver Channels 4 to 20 (CDR/SERDES) —
Max Transceiver Data Rate 3.1875 Gbps —
Kemasan 672-ball FC-FBGA —
Package Body Size 33 x 33 mm —
Ball Pitch 1.0 mm —
Suhu Operasi -40C to +85C (Industrial) 0 C to 85 C (Commercial)
Jenis Pemasangan Surface Mount Surface Mount (FBGA)
Lead-Free Yes —
Status RoHS Compliant —
Logic Family CMOS (SRAM-based FPGA) —
Total I/O Pins [DATA_NEEDED: total user I/O pin count] —
Embedded Memory [DATA_NEEDED: TriMatrix memory block count] —
Series — Stratix GX
User I/O Count — 455
Total RAM Bits — 1,944,576 bits
Supply Voltage (Core) — 1.5 V (1.425 V to 1.575 V)
Transceiver Data Rate — Up to 3.1875 Gbps
Number of Transceivers — 20
DSP Blocks — 10 (dedicated 18x18 multipliers)
Package Type — 672-ball Flip-Chip BGA (FBGA-672)
Package Dimensions — 27 mm x 27 mm, 1.0 mm pitch
Speed Grade — C5
Configuration Modes — PS, PPS, FPP, JTAG
Lead Free / RoHS — Lead free per Altera/Intel datasheet

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