EP1SGX25DF672I7N vs EP1SGX25DF672I7 Perbandingan
Perbandingan bersamaan detil EP1SGX25DF672I7N dari Intel dan EP1SGX25DF672I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1SGX25DF672I7N | EP1SGX25DF672I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix GX | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | CMOS 130 nm |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Paket | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| Suhu Kerja | 0 °C to 85 °C (industrial) | — |
| Lead-Free | Yes | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball (BGA) | Ball (BGA) |
| Number of Terminals | 672 | 672 |
| Series | — | Stratix GX |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| Total RAM Bits | — | 1,944,576 |
| Number of Logic Array Blocks (LABs) | — | 455 |
| Maximum Internal Clock Frequency | — | 4385.97 MHz |
| Combinatorial CLB Delay (max) | — | 9.48 ns |
| Nominal Supply Voltage | — | 1.5 V |
| Operating Temperature Grade | — | MILITARY / Industrial |
| Speed Grade | — | I7 (slowest industrial) |
| Package Code | — | DF (672-ball FC-FBGA) |
| Package Shape | — | Square |