EP1SGX25DF672I7N vs EP1SGX25DF672I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF672I7N sa pamamagitan ng Intel at EP1SGX25DF672I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25DF672I7N | EP1SGX25DF672I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix GX | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | CMOS 130 nm |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Packhaging | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| Temperature na Operasyon | 0 °C to 85 °C (industrial) | — |
| Lead-Free | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball (BGA) | Ball (BGA) |
| Number of Terminals | 672 | 672 |
| Series | — | Stratix GX |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| Total RAM Bits | — | 1,944,576 |
| Number of Logic Array Blocks (LABs) | — | 455 |
| Maximum Internal Clock Frequency | — | 4385.97 MHz |
| Combinatorial CLB Delay (max) | — | 9.48 ns |
| Nominal Supply Voltage | — | 1.5 V |
| Operating Temperature Grade | — | MILITARY / Industrial |
| Speed Grade | — | I7 (slowest industrial) |
| Package Code | — | DF (672-ball FC-FBGA) |
| Package Shape | — | Square |