EP1SGX25DF672I7N vs EP1SGX25DF672I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF672I7N disebabkan oleh Intel dan EP1SGX25DF672I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1SGX25DF672I7N | EP1SGX25DF672I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix GX | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | CMOS 130 nm |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Kemasan | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| Suhu Operasi | 0 °C to 85 °C (industrial) | — |
| Lead-Free | Yes | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball (BGA) | Ball (BGA) |
| Number of Terminals | 672 | 672 |
| Series | — | Stratix GX |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| Total RAM Bits | — | 1,944,576 |
| Number of Logic Array Blocks (LABs) | — | 455 |
| Maximum Internal Clock Frequency | — | 4385.97 MHz |
| Combinatorial CLB Delay (max) | — | 9.48 ns |
| Nominal Supply Voltage | — | 1.5 V |
| Operating Temperature Grade | — | MILITARY / Industrial |
| Speed Grade | — | I7 (slowest industrial) |
| Package Code | — | DF (672-ball FC-FBGA) |
| Package Shape | — | Square |