EP20K100CF324C9 vs EP20K100CF324C8 Perbandingan
Perbandingan bersamaan detil EP20K100CF324C9 dari Intel dan EP20K100CF324C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP20K100CF324C9 | EP20K100CF324C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | APEX II | — |
| Family | APEX 20K | APEX-20K |
| Logic Elements | 4160 | 4,160 |
| Typical Gates | 100000 | 100,000 |
| Maximum User I/O | 246 | 246 |
| Paket | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Suhu Kerja | 0C to +85C (Commercial) | 0°C to +85°C (commercial) |
| Speed Grade | -9 (C9) | C8 (commercial, 8 ns) |
| Tipe Mounting | Surface Mount | — |
| Core Voltage | 1.8 V (typical, APEX II) | 1.8 V typical |
| I/O Voltage Support | 2.5 V / 3.3 V | — |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive serial | JTAG (IEEE 1149.1), serial/parallel |
| Embedded System Blocks | Yes (ESB for RAM/ROM/CAM) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Embedded RAM Bits | — | 53,248 |
| Embedded System Blocks (ESBs) | — | 26 |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.18 µm CMOS |
| I/O Standards | — | LVCMOS, LVTTL, SSTL, HSTL |
| Design Software | — | Quartus II (legacy) |